Manufacturing Update to Use "No-Clean" Solder Paste Material

Notice Id: 76
Type: General
Effective On: Oct 09, 2017
Published: October 03, 2017 Products Affected: All Products

Notice Id: 76 | Type: General | Effective On: Oct 09, 2017 | Published: October 03, 2017 | All Products

Dear Valued Customer,

We are contacting you today to let you know that we are doing a Manufacturing Update to Use "No-Clean" Solder Paste Material.  Technologic Systems strives to continuously improve on our production processes to provide our customers the highest quality products at competitive prices.  As a part of this improvement process we will be transitioning many of our products and processes to make use of a "No-Clean" solder paste material.  You may begin to notice a residue near the solder joints on the products you purchase from Technologic Systems, this is a non-conductive, non-corrosive protective layer that results from a no-clean solder paste process. No-clean solder paste is well used through out the electronics component industry, and it provides the same robust and high quality solder connection as the solder paste that requires a water wash. Technologic Systems will begin using the no-clean materials to improve our processes with respect to components that may be sensitive to water exposure, or as a part of our repair process to reduce the likelihood of damage from corrosive solder paste materials, or secondary water washes. 

Please contact us as soon as possible if with any concerns regarding this change, we are happy to work with you through this transition.

Technologic Systems appreciates your business. If you have further questions or concerns, please contact us by either replying to this email or filling out the contact us form at

Best Regards,

Technologic Systems
16525 East Laser Drive
Fountain Hills, AZ 85268
Phone: (480) 837-5200
Fax: (480) 837-5300

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